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Multichip Modules (MCMs)
| Fort Wayne Wire Die, Inc. |
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Manufacturer of single crystal natural diamond, single crystal synthetic diamond and polycrystalline diamond dies for drawing copper, aluminum, gold, brass, bronze, stainless steel, nickel-plated and copper-covered steel.
Submitted: Nov 06, 2000
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| Dymax Corporation |
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Dymax manufactures adhesives, UV curing lamps and material handling equipment used for medical, electronic, automotive, motor, speaker, aerospace, appliance, electrical, optical, novelty, and metal, glass and plastic applications.
Submitted: Nov 06, 2000
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| Fujipoly |
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Fujipoly manufacturers and distributes electronic packaging components including Zebra elastomeric connectors, Sarcon thermal management materials and gaskets, EMI/RFI as well as silicone rubber extrusions and co-extrusions.
Submitted: Nov 06, 2000
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| M.S. Kennedy Corporation |
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MSK is a producer of custom hybrids, power hybrids and multi-chip modules, applying our circuit design expertise and versatile packaging capabilities to each circuit produced.
Submitted: Nov 21, 2000
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| Sanmina Corporation |
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Sanmina Corporation is an independent provider of customized integrated electronic manufacturing services (EMS), including turnkey electronic assembly and manufacturing management services, to original equipment manufacturers (OEMs) in the electronics industry.
Submitted: Nov 06, 2000
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| Chip Supply, Inc. |
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Chip Supply is the semiconductor die distributor and value-added die processor. Chip Supply has contracts with major semiconductor manufacturers to process and distribute die and wafers for multichip modules, hybrids and other unencapsulated die applications.
Submitted: Nov 14, 2000
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| Darrah Electric Company |
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Darrah Electric Company manufactures DC power supplies and is a stocking distributor of power semiconductors, air and water cooled power assemblies.
Submitted: Nov 06, 2000
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| DSP Architectures, Inc. |
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Manufacturer of integrated circuiits (ICs), silicon cores and multi-chip modules (MCMs).
Submitted: Nov 06, 2000
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| Electro Scientific Industries, Inc. |
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Designs and manufactures sophisticated products used around the world in electronics manufacturing including: laser manufacturing systems for semiconductor yield improvement; production and test equipment for the manufacture of surface mount ceramic capacitors; laser trim systems for precise electrical tuning of circuits; precision laser and mechanical drilling systems for electronic interconnection; and machine vision systems.
Submitted: Nov 06, 2000
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| EMSTO |
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EMSTO is a service provided by NEXUS, a Network of Excellence on Multifunctional Microsystems, sponsored by the ESPRIT Programme of the European Commission.
Submitted: Nov 06, 2000
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| F & K Delvotec |
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F&K Delvotec offers a complete range of die and wire bonders for the production of discrete devices, complex ICs, Hybrid Systems and multi-chip modules (MCM) as well as the latest chip-on-board (COBs) applications.
Submitted: Nov 06, 2000
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| Maxtek |
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Maxtek’s Beaverton, Oregon facility is a center of excellence for the design, manufacture and testing of high speed, high frequency microelectronics packaging and interconnect solutions. These include: Hybrids, Multichip Modules (MCMs), and High Density Packages (HDPs). Maxtek’s offshore subsidiary, Maxtek Philippines, provides manufacturing and test expertise for high volume applications.
Submitted: Nov 19, 2000
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| MH Electronics |
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M H Electronics is a manufacturer of crystals, quartz crystals, radio crystals, pager crystals, amateur crystals, xtal, piezoelectric crystals, electronic components crystals and more... for the electronics community.
Submitted: Nov 06, 2000
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| Nam Tai Electronics, Inc. |
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Nam Tai is an electronics design and manufacturing service provider to some of the world's leading original equipment manufacturers (OEMs).
Submitted: Nov 06, 2000
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| PREMA Semiconductor |
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Provider of the most advanced analog and mixed-signal (analog/digital) technologies for systems-on-a-chip ASICs.
Submitted: Nov 19, 2000
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| PROMEX Industries, Inc. |
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Specializes in Microelectronics Assembly Technologies (MAT). These assembly techniques include Surface Mount Technology (SMT), Chip-On-Board (COB) and Thick Film Circuit manufacturing.
Submitted: Nov 06, 2000
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| Sac-Tec |
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Sac-Tec specializes in microelectronic packaging, design and manufacturing of multi chip modules (MCM), hybrids and surface mount modules.
Submitted: Nov 06, 2000
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| Teledyne Electronic Technologies |
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Teledyne Technologies designs and manufactures electronic communication and propulsion products, and provides advanced engineering services to a variety of customers around the world.
Submitted: Nov 06, 2000
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