Processors

Subcategories:

Rabbit Semiconductor  
Rabbit Semiconductor is a fabless semiconductor company specializing in microprocessors. Rabbit Semiconductor is a division of Z-World, Inc., a well-established supplier of small microprocessor based controllers. Rabbit Semiconductor is a member of the Fabless Semiconductor Association.
Submitted: Nov 12, 2000
SAMSUNG  
Semiconductor manufacturer of a wide range of electronic products, including smart phones, PCS phones, microwave ovens, HDTV and Dynaflat CDT.
Submitted: Oct 31, 2000
Concept Manufacturing, Inc.  
Concept Mfg., Inc, providing "SpeedChip" upgrade products for upgrading the microprocessor of Non-MMX (75-200Mhz) and MMX Computers to higher frequencies of up to 400Mhz and beyond. Upgrades for Intel, IBM, Dell, Compaq, HP, Packard Bell, Acer, Asus, AST, Micronics, and Gateway.
Submitted: Oct 31, 2000
MicroDesign Resources  
MicroDesign Resources is an information services company focused on enabling technology for personal computers and the high-performance microprocessor industry.
Submitted: Oct 31, 2000
Microway, Inc.  
Microway offers Alpha motherboards and add-in cards; custom designed, Alpha workstations for web/network servers, 3D design and DSP. Also 32-bit NDP Fortran, CICH, Pascal Compilers.
Submitted: Oct 31, 2000
Performance Semiconductor Corp.  
Performance Semiconductor is an integrated circuit manufacturer with focus on MIL-STD-883 compliant products, including a family of MIL-STD-1750A processors with both CMOS and SOS technologies, MIPS, R3000 micorporcessors and SRAM memory circuits.
Submitted: Nov 19, 2000
Transmeta  
Transmeta develops, in concert with OEM customers, platform solutions for the Mobile Internet Computing market. Transmeta's premier product line is the Crusoe processor for a new class of ultra-light mobile computers.
Submitted: Oct 31, 2000
White Electronic Designs Corporation  
Providing high-density memory, processor products, and PC Cards for commercial and military markets also manufacture ruggedized flat panel displays, interface devices, and electromech assemblies.
Submitted: Nov 19, 2000



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